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November 9, 2018
TE Connectivity’s High Frequency Nanominiature Contact Doubles Density, Reduces Packaging
TE Connectivity’s High Frequency Nanominiature Contact Doubles Density, Reduces Packaging
TE Connectivity has released its new NanoRF modules and contacts, which double the density of today’s VITA 67 RF modules for VPX embedded computing applications.
TE Connectivity has released its new NanoRF modules and contacts, which double the density of today’s VITA 67 RF modules for VPX embedded computing applications.
http://www.microwavejournal.com/rss/topic/3369-industry-newsIndustry Newshttp://www.microwavejournal.com/articles/31310-te-connectivitys-high-frequency-nanominiature-contact-doubles-density-reduces-packaging
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