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DAS Micro CellUCLA and SEMI Win NIST Funding to Produce Heterogeneous Integration Roadmap
UCLA and SEMI Win NIST Funding to Produce Heterogeneous Integration Roadmap
SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) announced that they have won a $300,000 grant from the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the U.S.
SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) announced that they have won a $300,000 grant from the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the U.S.
http://www.microwavejournal.com/rss/topic/3369-industry-newsIndustry Newshttps://www.microwavejournal.com/articles/38167-ucla-and-semi-win-nist-funding-to-produce-heterogeneous-integration-roadmap
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